Method for forming packaged microelectronic devices and devices thus obtained

摘要

A packaged microelectronic device ( 20 ) is provided comprising at least one electrode ( 10 ) comprising a chip ( 18 ) embedded in a package. The chip ( 18 ) comprises a back electrode ( 17 ) located at a first side of the chip ( 18 ), and electronic circuitry ( 14 ) located at a second side of the chip ( 18 ), the second side being opposite to the first side, and wherein the back electrode ( 17 ) is part of the package. A method for forming such packaged microelectronic devices ( 20 ) is also described.