| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-chip package where a plurality of semiconductor chips having different sizes are laminated and a method for manufacturing the same. <P>SOLUTION: The multi-chip package having a substrate, a plurality of the semiconductor chips that are laminated on the substrate and each has a different size, and including a pad group where a semiconductor chip each has a plurality of pads and a reference region of the pad group, arranging a plurality of the pads in each pad group in the same coordinate to the reference region, and vertically aligning a plurality of the semiconductor chips each having a reference region. <P>COPYRIGHT: (C)2008,JPO&INPIT |
