| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a condition that a shearing stress is generated on a joined face between a land of a mounting substrate and an external terminal to cause a sintered part of a ceramic base material and the external terminal of LCC to be peeled off at a joint part, thus generating a disconnection, when LCC using a ceramic wiring board is secondary-mounted on the mounting substrate. <P>SOLUTION: There is provided a structure of an LCC ceramic wiring board 1 having: a die pattern 11 and a plurality of wiring patterns 21 on an upper surface of a ceramic substrate 51, an external terminal 41 on a lower surface; and an end face electrode 31 formed in a semi-circle shaped recess grooves 101 of the same number as the number of wiring patterns 21 on a side surface. The end face of the wiring patterns 21 and the end face of the external terminal 41 are covered with the end face electrode 31 connected to the wiring patterns 21 and the external terminal 41, thereby packaging an LCC of a comparison form on a mounting substrate via solder. Thus, a disconnection of a transmitting passage due to a peel-off that occurs on a boundary between a ceramic base material 51 of the ceramic wiring board 1 and the external terminal 41 by an environment temperature variation, is prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT |
