| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pre-molding component for a light emitting diode package which has a structure where length of a wire can be shortened even if a heat sink is made high for improving heat dissipation, and to provide a manufacturing method for efficiently and inexpensively manufacturing the pre-molding component with the small number of processes and the light emitting diode package using the pre-molding component and having sufficient heat dissipation. <P>SOLUTION: A first lead 3 and a second lead 4 are formed of the same materials as the heat sink 2 whose cross section is a convex shape, and are bent and formed in such a way that they become the same height as an upper face of the heat sink 2. Main body resin molds 5 are embedded in gaps between the heat sink 2 and the first lead 3 and between the heat sink 2 and the second lead 4 so as to constitute the pre-molding component 9. A light emitting diode element 1 is mounted on the heat sink 2, and it is connected with the first lead 3 and the second lead 4 through the wires 7 and 8. They are covered with hemispherical transparent resin 6, and the light emitting diode package 10 is obtained. <P>COPYRIGHT: (C)2008,JPO&INPIT |
