PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the spending of an additive in the plating with a plating liquid containing the additive.

SOLUTION: The plating apparatus 200 is structured by arranging a laminated body 204 of a neutral filtration film 20 and a cation exchange film 208 between a substrate-to-be-treated 100 arranged in a plating bath 201 and an anode 220 so that the neutral filtration film 210 is positioned in the substrate-to-be-treated 100 side and separating the plating bath 201 into a first section 202a containing the substrate-to-be-treated 100 and the additive and a second section 202b containing the anode 220 by the laminated body 204.

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