发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device with which a small difference between cooling medium temperatures on inflow and outflow sides and a small cooling medium leak from a seal portion between a shielding case and a printed circuit board are achieved. SOLUTION: The cooling device installed with a printed circuit board includes: a plurality of heating elements 31 mounted on the printed circuit board 30; a cooling jacket 32 prepared while covering the heating elements; and a passage through which the cooling medium 7 flows in the cooling jacket. The cooling device is configured so that the cooling medium is introduced into distribution passages 35 of the cooling jacket which are prepared along one side of the printed circuit board and flows out through collecting passages 36 of the cooling jacket which are prepared along other side of the printed circuit board. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008042132(A) 申请公布日期 2008.02.21
申请号 JP20060218368 申请日期 2006.08.10
申请人 YOKOGAWA ELECTRIC CORP 发明人 ARASAWA EIKI
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
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