| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide composition having heat resistance and giving no effect in alkali developability, that is, satisfying both items of the heat resistance and the alkali developability at the same time, flexible wiring boards using the polyimide composition and a method for producing the wiring boards. SOLUTION: The alkali development is brought to be possible by imparting photosensitivity with having a photosensitizer. An imido-oligomer prepared by using an acid dianhydride monomer having 3, 3'-diphenylsulfone tetracarboxylic acid dianhydride and a first diamine having a hydroxyl group, and an acid dianhydride monomer having an alkylene structure in the molecule and a second diamine having a hydroxyl group is enhanced in its alkali solubility. Therefore, even when a cross-linking agent having two or more maleimide groups is added, the heat resistance is imparted without affecting the alkali developability. COPYRIGHT: (C)2008,JPO&INPIT
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