| 摘要 |
An apparatus and a method for packaging semiconductor devices. Disclosed are multi-die packaging apparatuses and techniques, especially useful for integrated circuit dice involving insulative substrates, such as silicon-on-insulator (SOI), where grounding of a base layer is not reasonably practical. Disclosed is a means for effectively grounding all layers of an integrated circuit device regardless of whether the device makes direct contact with a die-attach paddle.
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