COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH

摘要

An electrical component includes a conductive substrate (10), a tin layer (12) formed on the substrate, and a conformal coating (14) formed on the tin layer to impede tin whisker growth. The conformal coating comprises a polymer matrix (15) having gas-filled voids (16) dispersed therethrough. In a method for impeding tin whisker growth from a tin plating or finish formed over an electrical component, a gas is infused (30) into a liquid polymer. The tin plating or finish is then covered (32) with a conformal coating comprising the liquid polymer. Then, one or more of the temperature and pressure of the conformal coating are adjusted (34) to thereby create a dispersion of gas-filled voids comprising the gas in the conformal coating. .