| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device for enhancing reliability, and its manufacturing method, by preventing impairment of a bump electrode of the electronic device having the bump electrode as a junction portion. <P>SOLUTION: A bump electrode 30 made of metal body with a low fusing point for jointing a first component 10 and a second component 20; and a protective layer 40 formed on at least the side face of the bump electrode 30 for preventing transmission of substance which degrades the behavior of the bump electrode. The protective layer 40 is formed on the side face of the bump electrode 30 and at part of a pad electrode 15 so that the bump electrode 30 is not exposed. The bump electrode 30 is formed by metallic indium singularly, and the protective layer 40 is made of metal with high melting point, such as noble metal. A gap of the first and second components 10, 20 is filled up with under-fill material 35. <P>COPYRIGHT: (C)2008,JPO&INPIT |
