ELECTRODE CONNECTION STRUCTURE AND CONDUCTIVE MEMBER OF SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an electrode connection structure and conductive members used for the structure of a semiconductor device that can realize a low-stress and high-reliability electrical connection without using bumps, a semiconductor device that makes lamination of semiconductor chips possible without arranging a through via in the semiconductor chip, and a manufacturing method for the same.

SOLUTION: The conductive member 5 to connect a primary electrode 11 of a lower layer and a secondary electrode 21 of an upper layer is arranged on a partial surface or the whole surface of a recess portion that is depressed in a horizontal direction formed in an adhesion layer 3 located between the primary electrode 11 and the secondary electrode.

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