| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photo-setting and thermosetting resin composition and its cured product having excellent soldering heat-resistance necessary as a solder resist or a resist for package substrates, adhesiveness, electrical insulation and HAST resistance and giving a substrate having low curing shrinkage and free from warpage. <P>SOLUTION: The resin composition includes (A) a carboxyl-containing photosensitive resin produced by reacting (a) an epoxy compound having two or more epoxy groups in one molecule with (b) a compound having one or more hydroxyl groups and one reactive group except for hydroxyl group and reactive with epoxy group and (c) a monocarboxylic acid having an unsaturated group, and reacting the obtained reaction product with (d) a polybasic acid anhydride, (B) a urethane (meth)acrylate compound having carboxyl group, (C) a photopolymerization initiator, (D) a thermosetting component having two or more cyclic ether groups and/or cyclic thioether groups in one molecule, and (E) a diluent. <P>COPYRIGHT: (C)2008,JPO&INPIT |
