发明名称 CUTTING DEVICE AND CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cutting device and a cutting method capable of cutting a resin sealing element along a cut line including a curve and a polygonal line, securing favorable finishing quality, and eliminating adverse influences caused by machining heat. SOLUTION: A metallic wire 24 extending like a loop and having fixing abrasive particles is traveled in one direction at high speed. A resin sealing element 17 and a metallic wire 24 fixed to a left stage 21 and a right stage 22 are relatively moved, so that the metallic wire 24 is brought into contact with the resin sealing element 17, to cut the resin sealing element 17. In one array-like area R1 of the resin sealing element 17, first a vertical part WV which is a part of the metallic wire 24 is moved in a curving manner along a cut line including a cut line 12C having curves and polygonal lines, to cut the resin sealing element 17. Then, the vertical part WV is linearly moved along a cut line 12S only comprising straight lines (line segments), to cut the resin sealing element 17. Thereby, each area P included in the array-like area R1 is segmented into packages. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008036765(A) 申请公布日期 2008.02.21
申请号 JP20060213924 申请日期 2006.08.04
申请人 TOWA CORP 发明人 MAEDA KEIJI;KITADA RYOJI;NAKANO NORITOSHI;TAGASHIRA FUMIAKI
分类号 B24B27/06;H01L21/56 主分类号 B24B27/06
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