| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an electroless pure Ni plating film, which is excellent in solder joinability and solder wetting with a large amount of Ni without containing P, on the copper circuit part of a printed wiring board or a copper member such as the joining part of an electronic component, etc. SOLUTION: A pure Ni plating layer 10 without containing P in an electroless Ni plating film is formed on a Cu electrode 3, etc., in order to join by soldering the electronic component onto the printed wiring board composed of a glass epoxy resin base material 5. Thus, the electroless plating method excellent in solder joinability and solder wettability is provided. COPYRIGHT: (C)2008,JPO&INPIT |
