| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electronic component from becoming high in temperature by efficiently transferring heat from the electronic component to a heat accumulating body. SOLUTION: The apparatus is configured by assembling a metal substrate 4 mounted with an electronic component 5 of an electronic apparatus 1, an elastic bag 6 having a heat accumulating body 7 sealed therein, and a lower container 3 as a base, having a surface 3b for placing the bag 6 and a protrusion 3a protruding from the surface 3b and supporting the metal substrate 4 so as to oppose the surface 3b. In this case, the bag 6 is placed on the surface 3b of the lower container 3, the metal substrate 4 is placed on the protrusion 3a, the bag 6 is attached tightly on the metal substrate 4 over a region 4a of the metal substrate 4, where the electronic component 5 is mounted, while the bag 6 is made to press against the surface 3b with the metal substrate 4, and the protrusion 3a and the metal substrate 4 are fastened with screws 8 and fix them. COPYRIGHT: (C)2008,JPO&INPIT
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