发明名称 PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a paste applying apparatus and a paste applying method by which paste is applied precisely by preventing the change of the temperature of the paste. SOLUTION: The paste applying apparatus 10 for discharging the paste L in a cylinder 35 from a nozzle 33 by providing a screw 36 in the cylinder 35 so as to be freely rotated and applying the paste L on a substrate 31 is provided with a temperature control mechanism 49 provided in the screw 36 and for controlling the temperature of the paste L and a controller 56 for controlling the temperature control mechanism 49. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008036590(A) 申请公布日期 2008.02.21
申请号 JP20060217500 申请日期 2006.08.09
申请人 SHIBAURA MECHATRONICS CORP 发明人 ISHIYAMA HIDEKAZU
分类号 B05C5/00;B05C11/10;B05D1/26;G02F1/1339 主分类号 B05C5/00
代理机构 代理人
主权项
地址