发明名称 |
PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a paste applying apparatus and a paste applying method by which paste is applied precisely by preventing the change of the temperature of the paste. SOLUTION: The paste applying apparatus 10 for discharging the paste L in a cylinder 35 from a nozzle 33 by providing a screw 36 in the cylinder 35 so as to be freely rotated and applying the paste L on a substrate 31 is provided with a temperature control mechanism 49 provided in the screw 36 and for controlling the temperature of the paste L and a controller 56 for controlling the temperature control mechanism 49. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008036590(A) |
申请公布日期 |
2008.02.21 |
申请号 |
JP20060217500 |
申请日期 |
2006.08.09 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
ISHIYAMA HIDEKAZU |
分类号 |
B05C5/00;B05C11/10;B05D1/26;G02F1/1339 |
主分类号 |
B05C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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