SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to reduce peeling by enlarging a contact area between a sealing resin and semiconductor chips. A penetrating window(260) is formed in a substrate(210). A first group of semiconductor chips(221) are adhered to one side of the substrate, and a second group of semiconductor chips(222) are adhered on the other side of the substrate. The substrate and the semiconductor chips are electrically connected to each other via a bonding wire(230). The bonding wire and the first and second group of semiconductor chips are enclosed by a sealing resin(240) which is integrally formed on the substrate. Solder balls(250) are formed on the substrate.