发明名称 |
COMPOSITION FOR REMOVING PHOTORESIST LAYER AND METHOD FOR USING IT |
摘要 |
A composition for removing a photoresist layer and a method for using it are disclosed. The composition comprises chemical portion which includes water and chemical constituent dissolving or softening the photoresist layer and mechanical portion which is abrasive particles. Using the composition and the method according to the present invention can decrease the conventional two steps of removing a photoresist layer process to one step, thereby simplifying the procedure, shortening the removing time and reducing the cost. The chemical constituent in the composition according to the present invention is of low toxicity and poor flammability and the amount is small, which makes it more friendly with the environment and decreases the expense of disposing of the waste.
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申请公布号 |
KR20080016629(A) |
申请公布日期 |
2008.02.21 |
申请号 |
KR20077028924 |
申请日期 |
2007.12.11 |
申请人 |
ANJI MICROELECTRONICS (SHANGHAI) CORP. |
发明人 |
WANG SHUMIN;YU CHRIS CHANG |
分类号 |
G03F7/42;B24B27/033;B24B37/00 |
主分类号 |
G03F7/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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