| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved sealing structure of a light-emitting diode. <P>SOLUTION: The sealing structure of the light-emitting diode is a sealing structure of a side-emission light-emitting diode. The sealing structure of the side-emission light-emitting diode includes a base section, two electrodes, a light-emission diode chip and a sealing material. Of the above components, the base section has a recess. The two electrodes are provided on a bottom of the recess. The light-emission diode chip is provided on the bottom of the recess and also in electrical connection with the two electrodes. In the above configuration, the substrate of the light-emitting diode chip is ≥140 μm in thickness. The light-emitting diode chip is sealed by filling up the recess with the sealing material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
