| 摘要 |
PROBLEM TO BE SOLVED: To perform stably an inspection of electric characteristics on a wafer having minute and fine pitch electrodes. SOLUTION: A contact structure for inspection 12 is attached to the lower surface side of a circuit board 10 in a probe card 2. Sheets 21, 22 which have elasticity and have convex shaped, electrically conductive parts 30, 50 are attached to the both sides of a silicon substrate 20 in the contact structure 12. Current-carrying paths 23 are formed in the silicon substrate 20, passing through the substrate in the vertical direction so that the conductive parts 30, 50 of the sheets 21, 22 come into contact with the upper and lower sides of the current-carrying paths 23. The sheet 21 is fixed to the circuit board 10, and the conductive part 30 makes contact with the connecting terminals of the circuit board 10. Electrode pads U on the wafer W are pressed against their respective conductive parts 50 and come into contact with them, when the inspection of the electrical characteristics on the wafer is performed. The conductive parts 50 absorb the variations in the heights of the electrode pads U, and the conductive parts 30 absorb the distortions and tilt of the circuit board 10 side, and then the contact between the conductive parts 50 and the electrode butts U is maintained within the confines of the wafer surface. COPYRIGHT: (C)2008,JPO&INPIT
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