| 摘要 |
PROBLEM TO BE SOLVED: To simplify a manufacturing process of a semiconductor device, and cut down its cost, and further, thin its thickness, and moreover, minimize it, in the packaged semiconductor device; and to provide its manufacturing method. SOLUTION: In the packaged semiconductor device, a device element 1 is formed on a semiconductor substrate 2, and each pad electrode 4 connected electrically with the device element 1 is formed. A supporting body 7 is stuck on the front surface of the semiconductor substrate 2 via an adhesive layer 6. Further, a protective layer 11 for covering therewith the side and rear surfaces of the semiconductor substrate 2 is so formed as to open its position corresponding to each pad electrode 4. Moreover, each conductive terminal 12 is formed on each pad electrode 4 in the position of the opening formed in the protective layer 11. Furthermore, no wiring and no conductive terminal are formed on the rear surface of the semiconductor substrate 2, and each conductive terminal 12 is so formed that it is on the outer periphery of the supporting body 7 and is adjacent to the outside of the side wall of the semiconductor substrate 2. COPYRIGHT: (C)2008,JPO&INPIT |
