发明名称 PACKAGE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a package for an electronic component which has a base or lid member, and a lid or a base member airtightly sealed, the packet for the electronic components having a GTMS structure using a transparent glass substrate for one member. SOLUTION: The package for the electronic component comprises the base member 10 and lid member 20, and has a crystal piece 30 mounted and disposed on the base member 10. Here, the base member 10 is formed of a glass substrate 16 of a silicic acid glass material having a through conductor having a metal frame 12 of 42 alloy and an internal electrode connected to a sealing alloy, and has space of a hollow 18 nearly in the center of the glass substrate 16 where the crystal piece 30 is mounted. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008042512(A) 申请公布日期 2008.02.21
申请号 JP20060214054 申请日期 2006.08.07
申请人 NEC SCHOTT COMPONENTS CORP 发明人 FUKUSHIMA DAISUKE;MORIZAKI YASUTOSHI;KAMATA HIROSHI
分类号 H03H9/02 主分类号 H03H9/02
代理机构 代理人
主权项
地址