| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide film suitable as a base material for electronic parts even withstanding services at extremely high temperatures, having high stiffness and extremely high heat resistance, in particular excellent in retaining its own mechanical properties after exposed to high-temperature moist heat circumstances. SOLUTION: The polyimide film is obtained by polycondensation between an aromatic diamine and an aromatic tetracarboxylic acid. Particularly, the polyimide film has pyromellitic acid residues as at least those of the aromatic tetracarboxylic acid and aromatic diamine residues with benzoxazole structure as at least those of the aromatic diamine. In the polyimide film, the amount of decomposition products derived from the film-constituting polymer is 0.01-7 ppm. COPYRIGHT: (C)2008,JPO&INPIT
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