发明名称 ROLLED COPPER FOIL
摘要 PROBLEM TO BE SOLVED: To provide rolled copper foil not only having excellent bending resistance, but also having extremely reduced deterioration in strength even if being stored at room temperature over a long period, and suitable for a flexible printed circuit (FPC). SOLUTION: The rolled copper foil comprises, by weight,≥99.9% copper, 0.0001 to 0.015%, desirably, 0.0001 to 0.001% oxygen, and the balance inevitable impurities. In the cross-sectional structure of the copper foil 1 annealed after final rolling, the cross-sectional area ratio of the crystal grains 2 penetrated the copper foil 1 in a sheet thickness direction is≥40%. The rolled copper foil has high initial tensile strength, and its tensile strength after being left at 30°C for a year is≥350 MPa. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008038169(A) 申请公布日期 2008.02.21
申请号 JP20060211539 申请日期 2006.08.03
申请人 SUMITOMO KINZOKU KOZAN SHINDO KK 发明人 YAMAGISHI KOICHI;TAKEDA RIKIO
分类号 C22C9/00;H05K1/09 主分类号 C22C9/00
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