发明名称 MOUNTING METHOD FOR SHAPE MEMORY ALLOY WIRE
摘要 PROBLEM TO BE SOLVED: To provide a mounting method for a shape memory alloy wire capable of acquiring stable actions by effectively blocking that its contact of the shape memory alloy wire is worsened and its base of the shape memory alloy wire is broken even though contracted actions are repeated. SOLUTION: The mounting method for a shape memory alloy wire is provided with a through-hole forming process for forming a through-hole, which makes the shape memory alloy wire pass through, on a connecting terminal section of a print board, a soldering process in which an end section of the shape memory alloy wire is inserted into the through-hole formed in the through-hole forming process by making the end section of the shape memory alloy wire in a looped shape so that the loop is located at a conductive side and the through-hole portion at the conductive side and loop-shaped shape memory alloy wire are respectively covered by solder, and a crimping process for crimping soldered portions after the soldering process. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008038802(A) 申请公布日期 2008.02.21
申请号 JP20060215622 申请日期 2006.08.08
申请人 NIDEC COPAL ELECTRONICS CORP 发明人 SAKAGUCHI KENJI
分类号 F03G7/06 主分类号 F03G7/06
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