| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure and a method for manufacturing that can lower cost of an image sensor module and raise the yield and reliability. <P>SOLUTION: The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C), and the flexible printer circuits (F.P.C) have a plurality of solder joints for transmitting signals of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side-by side-structure or a stacking structure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
