| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering structure capable of improving the soldering strength between the terminal of an electronic component and the solder. SOLUTION: In this soldering structure, a DC jack 20 is soldered to a wiring board 10, and the DC jack 20 has terminals 22, each having a through hole 22a capable of receiving solder (pasty solder) 70. When the terminal 22 of the DC jack 20 is doldered to the wiring board 10 with the solder (paste-like solder) 70, the solder (pasty solder) 70 flows into the periphery 22b of the terminal 22 and inside the through-hole 22a, and the terminal 22 and the wiring board 10 are soldered. COPYRIGHT: (C)2008,JPO&INPIT |
