| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving excellent junction between a semiconductor laser emitting a plurality of laser beams of different wavelength bands and a mount chip. SOLUTION: In an opposite surface of the semiconductor laser 1 where it faces the mount chip 200, the ridge height of an air ridge portion 38 of a first laser structure portion 3 is different from the ridge height of an air ridge portion 48 of a second laser structure portion 4. In an opposite surface of the mount chip 200 where it faces the semiconductor laser 1, a step difference according to the difference in the ridge heights of air ridge portions 38, 48 is provided on the arrangement position of a first electrode 201 opposite to the air ridge portion 38 of the first laser structure position 3 of the semiconductor laser 1 and the arrangement position of a second electrode 203 opposite to the air ridge portion 48 of the second laser structure position 4 of the semiconductor laser 1. COPYRIGHT: (C)2008,JPO&INPIT
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