发明名称 EPITAXIAL WAFER FOR SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an epitaxial wafer for semiconductor devices which can improve current gainβ, and its manufacturing method. SOLUTION: In the epitaxial wafer for semiconductor devices wherein a collector layer (3) consisting of at least a group III-V compound semiconductor, a base layer (4), and an emitter layer (5) are laminated and formed on a substrate (1), C density distribution in the base layer (4) is low near an interface between the emitter layer (5) and it. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008041965(A) 申请公布日期 2008.02.21
申请号 JP20060214841 申请日期 2006.08.07
申请人 HITACHI CABLE LTD 发明人 HIGASHIYA MASAHARU;KAWAGUCHI KAZUHISA
分类号 H01L21/331;H01L21/205;H01L29/205;H01L29/737 主分类号 H01L21/331
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