发明名称 ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent an electronic component from having high temperature by allowing heat generated from the electronic component of an electronic device to escape to a heat reservoir effectively. SOLUTION: In an electronic device 1, a heat reservoir 3 is enclosed in a container 2 having thermal conductivity, one surface 4a of an electronic component 4 having heat-generating properties is made to be in contact with one surface 2a of the container 2, a plurality of convexes 2c are provided on one inner surface 2b on the underside of one surface 2a of the container 2, and one inner surface 2b is made to be inclined so that a portion 2d directly under the electronic component 4 is farther from one surface 2a than a portion 2e not directly under the electronic component. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008041762(A) 申请公布日期 2008.02.21
申请号 JP20060211103 申请日期 2006.08.02
申请人 OMRON CORP 发明人 YOSHIOKA DAISUKE;TAKAGI KANJI;SANO HIDEYUKI;NORO YUKIHIRO;HAYASHI MASAAKI
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
代理机构 代理人
主权项
地址