Method of enabling solder deposition on a substrate and electronic package formed thereby

摘要

An electronic package includes a substrate ( 110, 310, 510 ) and a solder resist layer ( 120, 320, 520 ) over the substrate. The solder resist layer has a plurality of solder resist openings ( 121, 321, 521 ) therein. The electronic package further includes a finish layer ( 130, 330, 535 ) in the solder resist openings, an electrically conducting layer ( 140, 440 ) in the solder resist openings over the finish layer, and a solder material ( 150, 810 ) in the solder resist openings over the electrically conducting layer. The electrically conducting layer electrically connects the solder resist openings in order to enable the electrokinetic deposition of the solder material.