发明名称 |
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY AN INSULATING MEMBER AND WIRING STRUCTURES ON UPPER AND LOWER SURFACES OF THE SEMICONDUCTOR ELEMENT AND INSULATING MEMBER, AND MANUFACTURING METHOD THEREOF |
摘要 |
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an upper insulation film. An upper wiring layer formed on the upper insulation film, and the lower wiring layer formed below the base plate via lower insulation films are connected by conductors. A second semiconductor element is mounted exposed, being connected to the lower wiring layer.
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申请公布号 |
US2008044944(A1) |
申请公布日期 |
2008.02.21 |
申请号 |
US20070853683 |
申请日期 |
2007.09.11 |
申请人 |
CASIO COMPUTER CO., LTD. |
发明人 |
WAKISAKA SHINJI;JOBETTO HIROYASU;WAKABAYASHI TAKESHI;MIHARA ICHIRO |
分类号 |
H01L21/00;H01L21/60;H01L23/538;H01L25/065 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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