发明名称 Integrated Circuit Chip Utilizing Oriented Carbon Nanotube Conductive Layers
摘要 A conductive layer in an integrated circuit is formed as a sandwich having multiple sublayers, including at least one sublayer of oriented carbon nanotubes. The conductive layer sandwich preferably contains two sublayers of carbon nanotubes, in which the carbon nanotube orientation in one sublayer is substantially perpendicular to that of the other layer. The conductive layer sandwich preferably contains one or more additional sublayers of a conductive material, such as a metal. In one embodiment, oriented carbon nanotubes are created by forming a series of parallel surface ridges, covering the top and one side of the ridges with a catalyst inhibitor, and growing carbon nanotubes horizontally from the uncovered vertical sides of the ridges. In another embodiment, oriented carbon nanotubes are grown on the surface of a conductive material in the presence of a directional flow of reactant gases and a catalyst.
申请公布号 US2008042287(A1) 申请公布日期 2008.02.21
申请号 US20070924894 申请日期 2007.10.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FURUKAWA TOSHIHARU;HAKEY MARK C.;HOLMES STEVEN J.;HORAK DAVID V.;KOBURGER CHARLES W.III;MITCHELL PETER H.
分类号 H01L23/52;H01L27/28;H01L51/30 主分类号 H01L23/52
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