| 摘要 |
<p>PURPOSE: A power semiconductor module is provided to be capable of preventing a chip from being damaged and improving thermal resistance by using a support pin for completely attaching a lead frame pad on an insulating heat sink. CONSTITUTION: A power semiconductor module is provided with an insulating heat sink(102), a lead frame pad(112) attached on the upper surface of the insulating heat sink, a plurality of support pins(108) installed at the upper portion of the lead frame pad for pressing the lead frame pad to the vertical direction, a semiconductor chip(104) attached on the lead frame pad, a lead(114) electrically connected with the semiconductor chip for transmitting the signal generated from the semiconductor chip to the outside, an encapsulating part for selectively enclosing the resultant structure.</p> |
