POLISHING PAD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING SEMICONDUCTOR SUBSTRATE HAVING THE SAME

摘要

A polishing pad is provided to uniformly polish a wafer by forming a groove and plural patterns composed of channels on a surface of the polishing pad. A polishing pad includes a groove(211) for flow of slurry and plural patterns composed of trenches having a specific size. The patterns are formed by two trenches which are formed at two desired positions and extend in a direction in which an interval of the channels is gradually decreased. The patterns have a first V-shaped or U-shaped pattern and a second pattern which corresponds to the inversed first pattern. The first pattern and the second pattern intersect with each other in a radial direction of the polishing pad.