| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device capable of miniaturizing a loading device by making it possible to carry out further thinning. <P>SOLUTION: A light emitting device 10 is equipped with: a light emitting element 11; and an insulating substrate 12 in which the light emitting element 11 is loaded, and a first electrode 14 and a second electrode 15 are provided at a bottom face thereof. In the insulating substrate 12 there are provided: a first concave 161 which is formed by a first via hole 121 provided in the insulating substrate 12, and the first electrode 14 exposed by the first via hole 121 in order to carry out a die bond of the light emitting element 11; a second concave 162 which is formed by a second via hole 122 provided in the insulating substrate 12, and the second electrode 15 exposed by the second via hole 122 in order to carry out a wire bonding from the light emitting element 11 to the second electrode 15; and a third concave portion 163 which is formed by a third via hole 123 provided in the insulating substrate 12, and the first electrode 14 exposed by the third via hole 123 in order to carry out the wire bonding from the light emitting element 11 to the first electrode 14. <P>COPYRIGHT: (C)2008,JPO&INPIT |
