| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of cases for electronic equipment which are strong and whose design can easily be changed. SOLUTION: The thermoformable panel material 10 is composed by laminating a transparent, high-hardness outer material layer 13, a pattern layer 12 designed by the printing method and the like and an inner surface layer 11 and filled with a substrate 20 consisting of a foamable material and the like that has been molten in a molding die to be molded into an integral form. The outer material layer of the outermost layer has high hardness and protects the inside pattern layer, the design can easily be changed by changing the pattern layer, and the equipment within the case can be protected from shock by the substrate layer. COPYRIGHT: (C)2008,JPO&INPIT |
