| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition having excellent adhesiveness and imparting a cured product with excellent heat resistance. SOLUTION: The invention relates to the curable composition comprising an oxyalkylene polymer (P) composed of a polyoxyalkylene chain bonded with a reactive silicon group through a urethane bond, an imidazole silane compound (A) having an imidazole group represented by general formula (I) and an alkoxy group-containing reactive silicon group having at least one alkoxy group bonded to silicon atom. In the formula (I), R<SP>1</SP>is an H or 1-20C alkyl group, R<SP>2</SP>is an H, a vinyl group or a 1-5C alkyl group. COPYRIGHT: (C)2008,JPO&INPIT
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