| 摘要 |
A method of etching a wafer includes the steps of holding the wafer on a chuck table in the condition where a recessed part formed in the wafer by grinding is directed up, and supplying a required amount of an etchant into the recessed part to perform etching. Subsequently, the wafer is rotated together with the chuck table, the etchant in the recessed part is removed by scattering it away by a centrifugal force, and thereafter pure water is supplied to the recessed part, in the condition where the chuck table is kept rotating, so as to clean the recessed part.
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