发明名称 Memory structure and method for preparing the same
摘要 A memory structure comprises a semiconductor substrate, an active are positioned in the semiconductor substrate, a plurality of doped regions positioned in the semiconductor substrate, a first conductive plug connecting a bit line and one of the doped regions and a second conductive plug connecting a capacitor and another one of doped regions. The first conductive plug includes a first block positioned in the active area and a second block positioned at a first side of the active area, and the bit line electrically connects the second block. The second conductive plug includes a third block positioned in the active area and a fourth block positioned at a second side of the active area, and the capacitor electrically connects the fourth block. The first side of the active area is opposite to the second side of the active area.
申请公布号 US2008044970(A1) 申请公布日期 2008.02.21
申请号 US20060516627 申请日期 2006.09.07
申请人 PROMOS TECHNOLOGIES INC. 发明人 CHIEN JUNG WU;HSIAO CHIA SHUN
分类号 H01L21/8244;H01L21/8234 主分类号 H01L21/8244
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