| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low temperature-sinterable ceramic composition sinterable at low temperatures, and suitable for use as a raw material of electronic components which can be sintered at a low temperature and suitable for use as a raw material of electronic components manufactured via a firing process while suppressing shrinkage in a planar direction by a shrinkage-controlling construction process. <P>SOLUTION: This low temperature-sinterable ceramic composition fired at a firing temperature of ≤1,000°C comprises (a) >75 to ≤95 wt.% content of a ceramic material free of glass and sinterable at ≤1,000°C and (b) ≥5 to <25 wt.% content of borosilicate glass, where one having a softening point by 50-150°C lower than the firing temperature as the borosilicate glass. A green laminate 32 comprising a green layer 1a for a substrate consisting of the low temperature-sinterable ceramic composition and the shrinkage-suppressing layer 31 is formed, wherein the low temperature-sinterable ceramic composition is sintered but the shrincage-controlling layer 31 is substantially not sintered. <P>COPYRIGHT: (C)2008,JPO&INPIT |
