| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC chip built-in disk medium preventing physical strength and flatness from being damaged in a metallic film layer nonformation area, and securing a wide reading area. <P>SOLUTION: An IC chip 5 is mounted on a boundary peripheral edge part of the metallic film layer nonformation area 3 and a metallic film layer formation area 4, in the disk medium 1A. The IC chip 5 is mounted on the surface of a metallic film layer 4a. An L-shaped slit 6A is formed in the metallic film layer 4a at a position where the IC chip 5 is mounted. The signal input/output electrodes 5a, 5b of the IC chip 5 are connected to the metallic film layer 4a positioned at both sides of the slit 6A. Consequently, the metallic film layer 4a can be used as an antenna for the IC chip 5, and also the impedance of the IC chip 5 can be matched with the impedance of the antenna formed by the metallic film layer 4a. <P>COPYRIGHT: (C)2008,JPO&INPIT |
