| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer dividing method for precisely forming a continuous deterioration layer along a predetermined dividing line at the intermediate portion in the thickness direction of a wafer even with the thickness of the wafer reduced, and precisely dividing the wafer into individual chips along the predetermined dividing line with the deterioration layer formed. SOLUTION: A wafer dividing method comprises: a wafer affixing step for affixing the surface of a wafer 2 to the surface of a holding plate 3 having rigidity through an adhesive layer; a grinding step for grinding the back face of the wafer that is affixed to the holding plate to a predetermined thickness; a deteriorated layer forming step for forming a deterioration layer 210 along a predetermined dividing line inside the wafer by irradiating with a pulse laser beam with a wavelength having permeability from the back face side of the wafer; a wafer transferring step for affixing the back face of the wafer to an adhesive tape that is fitted to an annular frame and stripping the holding plate from the surface of the wafer; and a wafer fracturing step for fracturing the wafer along the predetermined dividing line by applying an external force to the wafer that is affixed to the adhesive tape. COPYRIGHT: (C)2008,JPO&INPIT |
