| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a surface mounting electronic device is solder-joined on a circuit board, the surface mounting electronic device is mounted at a tilt, and thereby large mechanical stress is applied to the solder joint and cracks are easily generated in there. SOLUTION: A quartz vibrator 1 has such a structure that a quartz vibrating element 4 is stored in a concave portion formed by a base substrate 2 made by stacking insulation materials and a seam ring 3 arranged along the periphery of the top face of the base substrate 2, and is sealed by a lid 5. On the top face of the base substrate 2, two internal pads 6a and 6b are formed and are electrically and mechanically connected to lead electrodes of the quartz vibrating element 4 by a conductive adhesive. The internal pads 6a and 6b are conducting with a pair of mounting terminals 7a and 7b formed on facing short sides of the bottom face of the base substrate 2 via through holes. At the four corners of the bottom face of the base substrate 2, pillar members 9a, 9b, 9c, and 9d are formed, respectively, so that the quartz vibrator 1 may not be inclined when being solder-joined on the circuit board. COPYRIGHT: (C)2008,JPO&INPIT
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