| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed circuit board including bumps ensuring excellent connection reliability and productivity, and to provide a method of manufacturing the same. SOLUTION: The flexible printed circuit board is provided with an insulating layer, a wiring layer formed at least on one surface of the insulating layer, and a bump formed of the same material as a wiring layer and integrally constituted with the wiring layer. Consequently, separation and missing of bump at the interface between the wiring layer and bump are never generated because such interface does not exit. Accordingly, according to FPC, it is possible to provide a flexible printed circuit board for obtaining uniform and higher connection reliability at the time of connection of components. COPYRIGHT: (C)2008,JPO&INPIT
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