发明名称 Method and system for depositing alloy composition
摘要 Electric potential, current density, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation.
申请公布号 US2008041727(A1) 申请公布日期 2008.02.21
申请号 US20060507066 申请日期 2006.08.18
申请人 SEMITOOL, INC. 发明人 KIM BIOH;BERNT MARVIN;WILSON GREG;MCHUGH PAUL R.
分类号 C25D5/02;C25B9/00 主分类号 C25D5/02
代理机构 代理人
主权项
地址