| 摘要 |
The modified phenolic resin of the present invention has a specific structure in which a side chain of an aromatic ring having a hydroxyl group in a phenolic resin that is an alternate copolymer of a phenolic compound and a compound having a divalent connecting group, is substituted with a group represented by general formula (1-1). By using the modified phenolic resin as a hardener for epoxy resins, there are provided an epoxy resin, a composition thereof, and a cured product thereof having excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties. (In the formula, R<SUP>1 </SUP>represents a C<SUB>1-8 </SUB>linear, branched, or cyclic hydrocarbon group.) The present invention provides an epoxy resin composition with excellent adhesion and flame retardancy in uses such as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.
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