发明名称 THERMALLY DISAPPEARING RESIN PARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermally disappearing resin particle capable of being decomposed at a low temperature in a short time in a low-oxygen concentration atmosphere, leaving very little residue of a resin component, and hardly causing transformation and breakage of an obtained sintered inorganic material when used as a pore-forming agent or the like; and to provide a method for producing the thermally disappearing resin particle, a method for producing a sintered inorganic material, and the sintered inorganic material. <P>SOLUTION: The thermally disappearing resin particle contains a polyoxyalkylene resin. The resin particles of &ge;90 wt.% disappear within 2 hr by being heated to a prescribed temperature of 100-350&deg;C in the atmosphere of &le;5% oxygen concentration, and the residue of the resin components becomes &le;0.01 wt.% within 1 hr when the resin particles after disappearance of &ge;90 wt.% are further heated to a prescribed temperature of 200-400&deg;C. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008038098(A) 申请公布日期 2008.02.21
申请号 JP20060217329 申请日期 2006.08.09
申请人 SEKISUI CHEM CO LTD 发明人 INAOKA MIKI;OMURA TAKAHIRO
分类号 C08J3/12;C04B35/632 主分类号 C08J3/12
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