| 摘要 |
<P>PROBLEM TO BE SOLVED: To manage a manufacturing state of a semiconductor wafer by effectively narrowing down a point for conducting a detail inspection or observation on a number of defect candidates detected by an inspection device, and by accurately obtaining a coordinate of the point with the detail inspection or the observation conducted to correspond to a pattern miniaturization. <P>SOLUTION: A method for determining the defect substantial to the process management on the defect comprises the steps of conducting an alignment-error correction about the coordinate of a number of defect candidates outputted from the inspection device, selecting the detail inspection/observation point on the basis of the distance between the coordinate of a conducted number of defect candidates and the focused point such as a hot spot, taking the picture image at its position and the picture image in the vicinity of its position by the detail inspection device, obtaining the detail coordinate position of the defects detected from the taken picture image by the inspection device, and determining the defects on the basis of the obtained image and the detail coordinate position. <P>COPYRIGHT: (C)2008,JPO&INPIT |
