| 摘要 |
PROBLEM TO BE SOLVED: To meet requirements such as moisture resistance, mechanical strength, planarity and moldability, even if a hollow package for housing a semiconductor element consisting of a resin-made insulating substrate is reduced in size and thickness. SOLUTION: The hollow package 4 for housing a semiconductor element has a resin-made insulating substrate 1 having a recess 1a for housing a semiconductor element 3, and a lid 2 for sealing the recess 1a of the insulating substrate 1. In the package 4, a scale-like inorganic filler material is buried in the resin-made insulating substrate 1. COPYRIGHT: (C)2008,JPO&INPIT
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